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New hardmask technology patterns closely spaced, thin interconnects to 10nm and beyond.
May 21, 2015
By: DAVID SAVASTANO
Editor, Ink World Magazine
Applied Materials’ Applied Endura Cirrus HTX PVD system offers breakthrough technology for patterning copper interconnects at 10nm and beyond. As chip features continue to shrink, innovations in hardmask are required to preserve the pattern integrity of tightly packed, tiny interconnect structures. With the introduction of this technology, Applied enables scaling of the TiN* metal hardmask to meet the patterning needs of copper interconnects in advanced microchips. “Precision engineering of ...
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